The volumes of data transfer among and within serves, racks, boards and chips are growing exponentially. Optical communications, which has been the exclusive means for high-rate data transfer over long distance for decades, is now being required over much shorter scales. The sustainable future growth of data traffic and computation depends, to a large extent, on the ability to integrate optical communication functionalities with lower cost, higher energy efficiency, smaller footprint and better compatibility with electronics than the performance provided by present-day solutions.

Silicon photonics is the research field that is looking to implement the full functionality of optical communication systems, namely: waveguides, filters, light sources, amplifiers, modulators and detectors, in the silicon material platform alongside electronics. Our group is working on two aspects of this broad objective. 1) We design, fabricate and characterize integrated photonic circuits for the multiplexing and de-multiplexing of communication data channels based on wavelength; and 2) We develop procedures for the hybrid integration of additional materials alongside silicon, where necessary, which may provide functionalities that are absent in silicon. A primary example of the latter is wafer-bonding of InP-based layers, which can provide amplification of light and laser-diode sources.

Research topic 3
Research topic 3

• R. Califa, D. Munk, H. Genish, Yu. Kaganovskii, I. Bakish, M. Rosenbluh, and A. Zadok, "Large one-time photo-induced tuning of directional couplers in chalcogenide-on-silicon platform," Opt. Express 23, 28234-28243 (2015)
• I. Bakish, V. Artel, T. Ilovitsh, M. Shubely, Y. Ben-Ezra, A. Zadok, and C. N. Sukenik, "Self-assembled monolayer assisted bonding of Si and InP," Opt. Mater. Express 2, 1141-1148 (2012).

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